VDI has sputtering capabilities from web widths of 80 inches to .5” (12mm), and thicknesses of 1mm to 36GA (9 micron). Substrates include PET, Nylon, other web polymers, fabrics, foils, and flexible glass.
VDI sputters a variety of metals, alloys, dielectrics, transparent conducting oxides and ITO, or tin-doped indium-oxide. Metals include silver, copper, chrome, titanium and others. Alloys include nichrome, inconnel, and stainless steel. Dielectric materials include silicon dioxide (SiO2), titanium oxide (TiO2) and titanium nitride (TiN). Transparent conductive oxides include indium tin oxide (ITO) and aluminum zinc oxide (AZO).
Sputter deposition is a type of vacuum deposition process that involves the use of a high-energy plasma to “sputter” atoms or molecules from a target material and deposit them onto a substrate. The process takes place in a vacuum chamber, and the target material is typically a solid metal or compound that is placed in a cathode position. The substrate to be coated is placed in an anode position.
During the sputter deposition process, a high-energy plasma is created by applying an electrical current to the cathode. This plasma ionizes the atoms or molecules in the target material and causes them to be ejected from the surface. The sputtered atoms or molecules travel through the vacuum chamber and are deposited onto the substrate, forming a thin film or coating.
Sputter deposition is used in a variety of applications, including the production of electronic devices, optics, and decorative coatings. It is a useful technique because it allows for the precise control of the thickness and composition of the deposited film or coating, and it can be used to produce high-quality thin films and coatings.
VDI’s capabilities enable it to provide tight tolerances and uniformity of metal deposition, cross web, down-web, and roll-to-roll. In addition, our plasma treatment ensures improved metal adhesion in films.